Transient-Dynamics of Microcircuits and MEMS in Shock and Vibration

Synopsis

Micro-circuits and Micro-electromechanical systems are subject to accidental drop, shock-impact, large velocity deformation, and shock due to nearby impact in portable electronic applications. Damage initiation and progression in materials and interfaces, methodologies for survivability-prediction are not well understood. Applications being studied include – cellular phones, PDAs, notebook computers, missiles, tanks and unmanned airborne vehicles.

Representative Publications

1. Lall, P., A. Pandurangan, J. Suhling, and J. Deep, Non-Perpendicular High-G Shock on Potted Fine Pitch Electronics Under Sustained High Temperature Aging, in Proceedings of the IEEE-ITHERM, San Diego, CA, pp. 708-718, June 1-4, 2021.
2. Lall, P., T. Thomas, and K. Blecker, Prognostic and RUL Estimations of SAC105, SAC305 and SnPb Solders under Different Drop and Shock Loads using Long Short-Term Memory (LSTM) Deep Learning Technique, in Proceedings of the IEEE-ITHERM, San Diego, CA, pp. 644-658, June 1-4, 2021.
3. Lall, P., T. Thomas, and K. Blecker, Feature Vector Identification and Prognostics of SAC305 PCBs for Varying G-Levels of Drop and Shock Loads, in Proceedings of the IEEE-ITHERM, San Diego, CA, pp. 659-669, June 1-4, 2021.
4. Lall, P., Pandurangan, A., Dornala, V.K., Suhling, J., Deep, J., Lowe, R., Effect of Drop Angle Variation and Restraint Mechanisms on Surface Mount Electronics Under High-G Shock, ASME InterPACK, IPACK2019-6575, Anaheim, CA, pp. 1-12, Oct 7-9, 2019.
5. Lall, P., Dornala K., Suhling, J., Lowe, R., Foley, J., Life Prediction and RUL Assessment of Fine Pitch Solder Joint Fuze Electronics Under Mechanical Shock Loads Up To 50,000g, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 232- 244, May 31- June 3, 2016.
6. Lall, P., Kothari, N., Foley, J., Deep, J., Lowe, R., A Novel Micro-CT Based Finite Element Modeling Technique to Study Reliability of Densely Packed Fuze Assemblies, Proceedings of the IEEE-ITHERM, Las Vegas, Nevada, pp. 456- 464, May 31- June 3, 2016.
7. Lall, P., Dornala, K., Lowe, R., Foley, J., Survivability Assessment of Electronics Subjected to Mechanical Shock Up to 25,000g, Proceedings of the IEEE-ITHERM, Las Vegas, Nevada, pp. 507- 519, May 31- June 3, 2016.
8. Lall, P., Dornala, K., Zhang, D., Xie, D., Zhang, A., Transient Dynamics Model and 3D-DIC Analysis of New-Candidate For JEDEC JESD22-B111 Test Board, Electronic Components and Technology Conference, 64th ECTC, pp. 85-99, Orlando, FL, May 27-30, 2014.
9. Lall, P., Gupta, P., Goebel, K., Decorrelated Feature Space and Neural Nets Based Framework for Failure Modes Clustering in Electronics Subjected to Mechanical Shock, IEEE Transactions on Reliability, Vol. 61, No. 4, pp. 884-900, December 2012.
10. Lall, P., Lowe, R., Goebel, K., Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact, ASME J. Electron. Packag. 134, 021001-1 to 021001-10, 2012.
11. Lall, P., Gupta, P., Angral, A., Anomaly Detection and Classification for PHM of Electronics Subjected to Shock and Vibration, IEEE Transactions On Components, Packaging And Manufacturing Technology, DOI: 10.1109/TCPMT.2012.2207460 , Vol. 2, No. 11, pp. 1902-1918, 2012.
12. Lall, P., Lowe, R., Goebel, K., Prognostics Health Management of Electronic Systems Under Mechanical Shock and Vibration Using Kalman Filter Models and Metrics, IEEE Transactions On Industrial Electronics, Vol. 59, No. 11, November 2012.
13. Lall, P., Lowe, R., Goebel, K., Health Monitoring of Leadfree Electronics Under Mechanical Shock and Vibration with Particle Filter Based Resistance Spectroscopy, SMTA Journal, Volume 24, Issue 4, pp. 19-32, 2011
14. Lall, P., Shantaram, S., Kulkarni, M., Suhling, J., SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys, ASME InterPACK, pp. 1-17, Portland, Oregon, USA, July 6-8, 2011.
15. Lall, P., Kulkarni, M., Angral, A., Panchagade, D., Suhling, J., Digital-Image Correlation and XFEM Based Shock-Reliability Models for Leadfree and Advanced Interconnects, 60^th ECTC, Las Vegas, Nevada, pp. 91-105, June 1-4, 2010.
16. Lall, P., Shantaram, S., Panchagade, D., Peridynamic-Models Using Finite Elements for Shock and Vibration Reliability of Lead-free Electronics, 11^th ITHERM, Las Vegas, Nevada, pp. 1-12, June 2-5, 2010.
17. Lall, P., Gupte, S., Choudhary, P., Darveaux, R., “Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics,” IEEE TCPT, Vol. 32(2), pp. 365-377, 2009.
18. Lall, P., Iyengar, D., Shantaram, S., Pandher, R., Panchagade, D., Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration, IEEE Transactions On Electronics Packaging Manufacturing, Vol. 32, No. 4, pp. 311-324, October 2009
19. Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., “Damage Progression Using Speckle-Correlation and High-Speed Imaging for Survivability of Leadfree Packaging Under Shock,” Strain Journal, Vol. 45(3), pp. 267-282, 2009.
20. Lall, P., Panchagade, D., Iyengar, D., Shantaram, S., Schrier, H., “High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics,” IEEE TCPT, Vol. 32(2), pp. 378-395, 2009.
21. Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging, Lall, P., Panchagade, D., Choudhary, P., Gupte, S., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 104-113, March 2008.
22. Health Monitoring for Damage Initiation & Progression during Mechanical Shock in Electronic Assemblies, Lall, P., Choudhary, P., Gupte, S., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 173-183, March 2008.
23. Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging, Lall, P., Panchagade, D., Choudhary, P., Gupte, S., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 104-113, March 2008.
24. Smeared Property Models for Shock-Impact Reliability of Area-Array Packages, Lall, P. Panchagade, D., Liu, Y., Johnson, W., Suhling, J., ASME Journal of Electronic Packaging, Volume 129, pp. 373-381, December 2007.
25. Solder-Joint Reliability in Electronics Under Shock and Vibration using Explicit Finite Element Sub-modeling, Lall, P., Gupte, S., Choudhary, P., Suhling, J., IEEE Transactions on Electronic Packaging Manufacturing, Volume 30, No. 1, pp. 74-83, January 2007.
26. Smeared Property Models for Shock-Impact Reliability of Area-Array Packages, Lall, P. Panchagade, D., Liu, Y., Johnson, W., Suhling, J., ASME Journal of Electronic Packaging, Volume 129, pp. 373-381, December 2007.
27. Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact, Lall, P., Panchagade, D., Liu, Y., Johnson, W., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Volume 29, No. 3, pp. 464-474, September 2006.