High Strain-Rate Constitutive-Behavior of Electronic Materials

Synopsis

Material constitutive behavior of electronic materials at small-length scales and high strain-rates is not well-understood. Lack of material data limits the prediction capability and accuracy of computational models for transient dynamics of electronics subjected to shock and vibration. Electronic materials being studied include leadfree solders, low-k dielectrics, underfills, thin-film adhesives, fine-pitch copper traces and conformal coats.

Representative Publications

1. Lall, P., Yadav, V., Suhling, J., and Locker, D., “Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature.” ASME. J. Electron. Packag., 144(2): 021116, June 2022.
2. Lall, P., Mehta, V., Suhling, J., and Blecker, K., “High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days” ASME. J. Electron. Packag., 144(2): 021108, June 2022.
3. Lall, P., V. Mehta, V. Yadav, M. Saha, J. Suhling, and D. Locker, Extreme Low-Temperature High Strain-Rate Constitutive Behavior Evolution of Doped and Undoped Leadfree Solders under Sustained High Temperature Exposure, in Proceedings of the IEEE Electronic Components and Technology Conference, pp. 1646-1657, May 31-June 3, 2022.
4. Lall, P., V. Mehta, J. Suhling, and K. Blecker, High Strain Rate Mechanical Properties of M758 Solder at Extreme Surrounding Temperatures, with 100oC Isothermal Aging for up to 180 Days, in Proceedings of the InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 664-678, May 31-June 3, 2022.
5. Lall, P. Yadav, V., Suhling, J., Locker, D., Evolution of Anand Parameters with Elevated Temperature Aging for SnAgCu Lead-free Alloys, ASME Journal of Electronic Packaging, Vol. 143, No. 2, pp. 021005-1 to 021005-17, June 2021
6. Lall, P., V. Mehta, J. Suhling, and D. Locker, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C, in Proceedings of the ASME Journal of Electronic Packaging, Vol. 142, No. 4, 041104-1 – 041104-12, December 2020.
7. Lall, P., T. Thomas, V. Yadav, J. Narangaparambil, W. Liu, Acceleration Factor Modeling of Flexible Substrates from Actual Human Body Measurements, in Proceedings of the ASME Journal of Electronic Packaging, Vol. 142, No. 4, 041113-1 – 041113-11, December 2020.
8. Lall, P., Zhang, D., Yadav, V., Locker, D., High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature, Microelectronics Reliability, Volume 62, pp. 4-17, 2016.
9. Lall, P., Shantaram, S., Suhling, J., Locker, D., Stress-Strain Behavior of SAC305 at High Strain Rates, ASME Journal of Electronic Packaging, Volume 137, No. 1, doi:10.1115/1.4028641, pp. 1-16, March 2015.
10. Lall, P., Shantaram, S., Locker, D., High Strain Rate Properties of SAC105 and SAC305 Leadfree Alloys after Extended High Temperature Storage, Journal of the SMTA, Volume 27, No. 1, pp. 13-27, 2014