Flexible Hybrid Electronics

Synopsis

Flexible hybrid electronics allows the development of stretchable, bendable, foldable form-factors in electronics applications, which have not been possible with the use of rigid electronics technologies.  The existing electronics ecosystem and supply-chain is geared towards the manufacture of rigid electronics.  The manufacture of thin electronic architectures requires the development of solutions for unique challenges including the integration of thin-chips, flexible encapsulation, compliant interconnects, and development of stretchable inks for metallization traces. Furthermore, the integration of flexible hybrid electronics into high-reliability architectures requires the development of testing protocols to meaningfully inform manufacturing processes and ensure reliability and survivability under exposure to sustained harsh environmental operating conditions.

Representative Publications

1. Lall, P., Soni, V., and Miller, S., “Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures.” ASME. J. Electron. Packag., 144(2): 021112, June 2022.
2. Lall, P., H. Jang, and S. Miller, Reliability Characterization and Modeling of Flexible LCO battery Under Flexing and Calendar Aging for SOH degradation analysis, in Proceedings of the InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1278-1283, May 31-June 3, 2022.
3. Lall, P., and V. Soni, Effect of Storage on Reliability of Thin-Flexible Laminated and Unlaminated Batteries in Wearable Applications, in Proceedings of the IEEE Electronic Components and Technology Conference, pp. 1048-1059, May 31-June 3, 2022.
4. Lall, P., V. Soni, and S. Miller, Accelerated Life Cycling of Additively Printed Flexible Linear Charging Circuits and its Effect on Evolution of Line Resistance and Charging Current, in Proceedings of the InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 751-758, May 31-June 3, 2022.
5. Lall, P., V. Soni, G. Sethi, and K. Yiang, Effect of High and Low Storage Temperatures, Storage Duration and Varying Depth of Discharge on Coin Cell SOH Degradation, in Proceedings of the InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 904-911, May 31-June 3, 2022.
6. Lall, P., and V. Soni, SOH Degradation of Curved and Flat Li-ion Thin Flexible Batteries Subjected to Flex-to-Install Testing at Various Fold Diameters, in Proceedings of the InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1284-1290, May 31-June 3, 2022.
7. Lall, P., Jang, H., Soni, V., & Miller, S., Reliability and SOH Degradation of Thin Li-ion Batteries Under Various Flexing Conditions. Proceedings of ASME InterPACK, Vol. 85505, p. V001T03A004, 13-pages, IPACK2021-74065, October 26-28, 2021 .
8. Lall, P., Soni, V., & Miller, S., Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding. Proceedings of ASME InterPACK, Vol. 85505, p. V001T03A010, 8-pages, IPACK2021-74115, October 26-28, 2021.
9. Lall, P., H. Jang, C. Hill, and L. Creel, Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition, in Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, ASME INTERPACK, Paper IPACK2020-2644, pp. 1-8, October 27-29, 2020.
10. Lall, P., Goyal, K., Warpage of Flexible Board Assemblies with BGAs During Reflow and Post-Assembly Usage, Journal of Surface Mount Technology, Volume 32, No. 2, pp. 27-35, 2019.