Thermo-mechanics of Electronics in Harsh Environments

Synopsis

Electronics in harsh environments is exposed to temperature (100 to 200°C), humidity (100% RH), pressure (vacuum-to-high-pressure). Deformation and failure response of commercial fine-pitch electronics in harsh environments is not well understood. Environments being studied include – automotive underhood, on-transmission, unmanned airborne vehicles (UAV), unmanned ground-vehicles (UGV), tank, missile, avionics and space applications.

Representative Publications

1. Lall, P., Kasturi, M., Wu, H., Suhling, J., and Davis, E., “Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation.” ASME. J. Electron. Packag. 144(2): 021113, June 2022.
2. Lall, P., M. Kasturi, Y. Zhang, H. Wu, J. Suhling, and E. David, Effect of Underfill Property Evolution on Solder Joint Reliability in Automotive Applications, in Proceedings of the IEEE Electronic Components and Technology Conference, pp. 455-466, May 31-June 3, 2022.
3. Lall, P., P. Choudhury, and A. Pandurangan, Sustained High Temperature Fracture Toughness Evolution of Chip-UF and Substrate-UF Interfaces in FCBGAs for Automotive Applications, in Proceedings of the IEEE Electronic Components and Technology Conference, pp. 1577-1588, May 31-June 3, 2022.
4. Lall, P., and P. Choudhury, Influence of Sustained High Temperature Exposure on the Interface Bond Strength between TIM-Copper Substrates, in Proceedings of the InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 857-863, May 31-June 3, 2022.
5. Lall, P., Y. Zhang, M. Kasturi, P. Choudhury, H. Wu, J. Suhling, and E. Davis, Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year, in Proceedings of the IEEE Electronic Components and Technology Conference, pp. 971-982, June 1-July 4, 2021.
6. Lall, P., Y. Zhang, and J. Williamson, Degradation Mechanisms of Epoxy Molding Compound Subjected to High Temperature Long Term Aging, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, pp. 610-616, June 1-4, 2021.
7. Lall, P., K. Mirza, J. Suhling and D. Locker, Effect of Mean Temperature on the Evolution of Strain-Amplitude in SAC Ball-Grid Arrays during Operation under Thermal Aging and Temperature Excursions, in Proceedings of the 67th ECTC, Florida, pp. 1027-1038, May 30 – June 2, 2017.
8. Lall, P., K. Mirza, M. Harsha, K. Goebel, Microstructural Indicators for Assessment of Effect of Prolonged and Intermittent Storage on Reliability of Lead-free Electronics, IEEE Transactions on Device and Materials Reliability, Vol. 16, No. 3, pp. 304 – 317, 2016
9. Lall, P., Mirza, K., Assessment of the Effect of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure, SMTA Journal, Vol 28, No. 4, pp. 28-42, Dec 2015.
10. Lall, P., Deshpande, S., Luo, Y., Bozack, M., Nguyen, L., Murtuza, M., Degradation Mechanisms in Electronic Mold Compounds Subjected To High Temperature in Neighborhood of 200°C, Electronic Components and Technology Conference, 64th ECTC, pp. 242-254, Orlando, FL, May 27-30, 2014.
11. Lall, P., Limaye, G., SnAgCu Lead-Free Electronics Reliability Under Combined Temperature and Vibration Environments, Journal of the SMTA, Volume 26, No. 1, pp. 11-19, 2013.
12. Lall, P., Shirgaokar, A., Arunachalam, D., Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics, ASME J. Electron. Packag. Vol. 134, pp. 031008-1 to 031008-12, 2012.
13. System Design Issues for Harsh Environment Electronics Employing Metal-backed Laminate Substrates, Evans, J., Lall, P., Crain, E., Shete, T., Thompson, J. R., Naylis, D., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 74-85, March 2008.
14. Thermo-mechanical Reliability Management Models for Area-Array Packages on Cu-Core and No-Core Assemblies, Lall, P., Shah, M., Drake, L., Moore, T., Suhling, J., SMTA Journal, Vol. 21, No. 3, pp. 20-35, 2008.
15. Damage Mechanics of Electronics on Metal-Backed Substrates in Harsh Environments, Lall, P., Islam, M. N., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Volume 29, Number 1, pp. 204-212, March 2006.
16. Thermal Reliability Considerations for Deployment of Area Array Packages in Harsh Environments, Lall, P., Singh, N., Suhling, J., Strickland, M., Blanche, J., IEEE Transactions on Components and Packaging Technologies, Volume 28, Number 3, pp. 457-466, September 2005.
17. Model for BGA and CSP in Automotive Underhood Environments, Lall, P., Islam, N, Suhling, J., Darveaux, R., IEEE Transactions on Components and Packaging Technologies, Volume 27, Number 3, pp. 585-593, September 2004.