Short-Version CV

PRADEEP LALL, Ph.D., M.B.A.

MacFarlane Endowed Distinguished Professor and Alumni Professor
Director, Auburn University Electronics Packaging Research Institute
Auburn University, Auburn, AL 36849
Tele: (334) 844-3424, FAX: (334) 844-3450, Email: lall@auburn.edu

EDUCATION
University of MarylandMechanical EngineeringPh.D.1993
Northwestern UniversityFinance, StrategyM.B.A.2002
University of MarylandMechanical EngineeringM.S.1989
Delhi College of EngineeringMechanical EngineeringB.E.1988
APPOINTMENTS
2023-PresentAuburn UniversityMacFarlane Endowed Distinguished Professor Alumni Professor & Director
2019-2023Auburn UniversityMacFarlane Endowed Distinguished Professor & Director
2015 – 2019Auburn UniversityMacFarlane Endowed Professor & Director
2008 – 2015Auburn UniversityThomas Walter Professor & Director
2006 – 2008Auburn UniversityThomas Walter Professor & Associate Director
2005 – 2006Auburn UniversityThomas Walter Associate Prof & Associate Director
2004 – 2005Auburn UniversityAssociate Professor & Associate Director
2002 – 2004Auburn UniversityAssociate Professor
2001 – 2002Motorola, Inc.Distinguished Member of Technical Staff
1999 – 2001Motorola, Inc.Manager, Component & Interconnect Reliability Labs
1997 – 1999Motorola, Inc.Senior Staff Engineer
1994 – 1997Motorola, Inc.Lead Engineer
1992 – 1994CALCE CenterAssistant Director

SELECTED AWARDS AND HONORS (Selected from 48 Awards & Honors)

  1. SMTA Founder’s Award (2024)
  2. SEMI FlexTech Flexi R&D Achievements Award (2023)
  3. ASME Avram Bar-Cohen Memorial Medal (2022)
  4. IEEE Biedenbach Outstanding Engineering Educator Award (2020)
  5. Fellow of the NextFlex National Manufacturing Institute on Flexible Electronics (2019)
  6. AU Research Advisory Board’s Advancement of Research and Scholarship Achievement Award (2018).
  7. IEEE Sustained Outstanding Technical Contributions Award (2018)
  8. NSF-IUCRC Alex Schwarzkopf Award for Technology Innovation (2016)
  9. IEEE Exceptional Technical Achievement Award (2014)
  10. Fellow of Alabama Academy of Science (2014)
  11. ASME-EPPD Applied Mechanics Award (2013)
  12. SMTA Member of Technical Distinction Award (2013)
  13. Creative Research and Scholarship Award (2013)
  14. SEC Faculty Achievement Award (2013)
  15. Member, National Academies Committee, ETC and Unintended Acceleration (2010)

SELECTED BEST PAPER AWARDS (Selected from over 63-Awards)

  1. ITHERM 2024 Best Poster Award, Predictive Damage Modeling of Potted Assemblies under High-G Shock Loads, Pandurangan, A., Lall, P., Mechanics and Reliability Track, ITHERM Conference, Denver, CO, May 28-31, 2024.
  2. ITHERM 2024 Best Poster Runner-Up Award, Investigation of the Effects of Sustained High Temperature on the Reliability of Lead-Free Solder Joint Assemblies in Vibration, Mehta, V., Lall, P., Mechanics and Reliability Track, ITHERM Conference, Denver, CO, May 28-31, 2024.
  3. Outstanding Poster-Paper Award: Mechanics and Reliability Track: Influence of Component Interconnect with Printed Copper Circuits on Realized Mechanical and Electrical Characteristics in FHE Applications, Lall, P., J. Narangaparambil, and S. Miller, in Proceedings of the IEEE-ITHERM, pp. 950-960, May 31-June 3, 2022
  4. Nasser Grayeli Outstanding Poster Award: Effect of Fold Diameter on State-of-Health Degradation of Li-ion Batteries Subjected to U-Flex-to-Install and Dynamic U-Fold Testing, P. Lall, V. Soni, S. Miller, pp 1-8, ASME InterPACK International Technical Conference and Exhibition, Oct 26-28, 2021. 
  5. Prof. Avram Bar-Cohen Best Paper Award: Process Recipes for Additively Printed Copper-Ink Flexible Circuits using Direct Write Methods, Lall, P., J. Narangaparambil, K. Schulze, and C. Hill, in Proceedings of the IEEE-ITHERM, pp. 1061-1072, June 1-4, 2021.
  6. Outstanding Paper of Conference Award: Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition, Lall, P., H. Jang, C. Hill, and L. Creel, in Proceedings of the ASME INTERPACK, Paper IPACK2020-2644, pp. 1-8, October 27-29, 2020.
  7. 2014-2015 ASME Journal of Electronic Packaging Best-Paper Award (2015); for paper: Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Reliability Under Vibration, Lall, P., Lowe, R., ASME Journal of Electronic Packaging, Volume 136, No. 4, doi:10.1115/1.4028163, pp. 041013-1-to 041013-8, December 2014.
  8. Best-of-Conference Award: Lall, Modeling and Reliability Characterization of Area-Array Electronics Subjected to High-G Mechanical Shock Up to 50,000G, P., Patel, K., Lowe, R., Strickland, M., Blanche, J., Geist, D., Montgomery,  R., Proceedings of the 62nd ECTC, pp. 1194 – 1204, May 29-June 1, 2012.
  9. Best-of-Conference Award: Interrogation Of Damage-State In Lead-Free Electronics Under Sequential Exposure To Thermal Aging And Thermal Cycling, Lall, P., Vaidya, R., More, V., Goebel, K., SMTAI Technical Conference, Orlando, FL, pp. 405-418, Oct 24-28, 2010.
  10. Best Paper in Test and Measurement Track, Intermittency Detection and Mitigation in Ball Grid Array (BGA) Packages, Hofmeister, J.P., Lall, P., Goodman, D., Ortiz, E.G., Adams, M.G.P., Tracy, T.A. , AUTOTESTCON, pp. 40-49, Sept 17-20, 2007.
 SELECTED CONFERENCE PUBLICATIONS
  1. Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment, Lall, P., Kulkarni, S., Miller, S., Paper IPACK2024-141881, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-10, October 8-10, 2024.
  2. Fatigue-Fracture Propensity Measurement and Competing Risk Model for FCBGA Interfaces under Sustained Humidity and Temperature Exposure, Lall, P., Pandurangan, A., Choudhury, P., Kasturi, M., and Suhling, J., In Proceedings of ECTC 2024 Conference. Denver, CO, USA, pp. 142-149, May 28-31, 2024.
  3. Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders Under Sustained High Temperature Operation, Lall, P., Mehta, V., Saha, M., Suhling, J., and Locker, D., In Proceedings of ECTC 2024 Conference. Denver, CO, USA, pp. 1530-1537, May 28-31, 2024.
  4. Interfacial Reliability and Predictive Models for Potted Board Assemblies in Inclined 25000 g Mechanical Shock, Lall, P., Pandurangan, A., Choudhury, P., Suhling, J., and Blecker, K., In Proceedings of ECTC 2024 Conference. Denver, CO, USA, pp. 221-228, May 28-31, 2024.
  5. Comparison of Sustainable and Non-Sustainable Ink Process-Performance Interactions for Additively Printed Circuits., Lall, P., Soni, V., Bimali, S., Karakitie, D., and Miller, S., In Proceedings of ECTC 2024 Conference. Denver, CO, USA, pp. 982-989, May 28-31, 2024.
  6. Accuracy, Hysteresis and Extended Time Stability of Additively Printed Temperature and Humidity Sensors, Lall, P., K. Goyal, and J. Narangaparambil, in Proceedings of the IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 1070-1080, June 3-30, 2020.
  7. Property-Performance Relationships for Sustained High Temperature Operation of Electronics, Lall, P., Y. Zhang, M. Kasturi, H. Wu, E. Davis, and J. Suhling, in Proceedings of the IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 257-268, June 3-30, 2020.
  8. Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry, Lall, P., K. Goyal, N. Kothari, B. Leever, and S. Miller, ASME InterPACK, IPACK2019-6574, Amaheim, CA, pp. 1-10, Oct 7-9, 2019
  9. Effect of Charging Cycle Elevated Temperature Storage and Thermal Cycling on Thin Flexible Batteries in Wearable Applications, Lall, P., A. Abrol, B. Leever, and S. Miller, ECTC, Las Vegas, pp. 370-381, May 28-31, 2019.
  10. Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics, Lall, P., H. Zhang and R. Lall, ASME Interpack, CA, pp. 1-10 , Aug 29- Sept 1, 2017.
SELECTED JOURNAL PUBLICATIONS
  1. Critical Needs for Non-PFAS Semiconductor Packaging Materials, Lall. P., The BRIDGE Journal of the National Academies of Engineering, Vol. 54, No. 2, pp. 31-37, Summer 2024.
  2. Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor with Supercapacitive Material for Astronaut in Extreme Condition, Lall, P., Jang, H., and Hill, C., ASME. J. Electron. Packag., 146(4): 041114. https://doi.org/10.1115/1.4065940, December 2024.
  3. Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink, Lall, P., Bimali, S., and Miller, S., ASME. J. Electron. Packag. 146(4): 041116. https://doi.org/10.1115/1.4066041, December 2024. 
  4. Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging, Lall, P., Mehta, V., Suhling, J., and Blecker, K., ASME. J. Electron. Packag.; 146(3): 031006. https://doi.org/10.1115/1.4064521, September 2024.
  5. Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure, Lall, P., Pandurangan, A. R. R., and Blecker, K., ASME. J. Electron. Packag.; 146(3): 034502. https://doi.org/10.1115/1.4064604, September 2024.
  6. Leadfree SAC Solder Materials Characterization at High Strain Rates at Low Test Temperatures And Drop & Shock Simulation Using Input-G Method, Lall, P., Yadav, V., Suhling, J. C., and Locker, D., ASME. J. Electron. Packag. doi: https://doi.org/10.1115/1.4062868, June 29, 2023.
  7. Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter, Lall, P., Zhang, H., ASME Journal of Electronic Packaging, Volume 137, No. 2, doi: 10.1115/1.4028957, pp. 1-10, June 2015
  8. Reliability and Failure Modes of Solid-State Lighting Electrical Drivers Subjected to Accelerated Aging, Lall, P., Sakalaukus, P., Davis, L., IEEE Access Journal, Vol. 3, pp. 531-542, May 2015
  9. Prediction of L70 Life and Assessment of Color Shift for Solid State Lighting Using Kalman Filter and Extended Kalman Filter Based Models, Lall, P., Wei, J., IEEE Transactions on Device and Materials Reliability, Volume. 15, No.1, doi 10.1109/TDMR.2014.2369859, pp. 1-15, March 2015.
  10. Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Reliability Under Vibration, Lall, P., Lowe, R., ASME Journal of Electronic Packaging, Volume 136, No. 4, doi:10.1115/1.4028163, pp. 1-8, December 2014.
ENGINEERING AWARDS
  1. Algorithm to Prevent CPU Overflow, P. Lall, S. Potter, Engineering Award, 1997.
  2. Automated IC Package Pad Array Generation, P. Lall, S. Potter, Engineering Award, 1999.
  3. Method for Solder Joint Geometry Generation, P. Lall, K. Banerji, Engineering Award, 1999.
US PATENTS
  1. Method and Apparatus for Extending Fatigue Life of Solder Joints in Semiconductor Device, US 6,444,563, 2002
  2. Surface Mountable Flexible Interconnect, US 5,928,001, 1999
  3. Flexible Connector For Circuit Boards, US 5,742,484, 1998.
SELECTED CONFERENCE AND SESSION CHAIRMANSHIPS
  1. Board of Governors, IEEE Electronics Packaging Society (EPS), Jan-2019-Dec 2024. 
  2. VP of Publications, IEEE Reliability Society, 2017-2018
  3. Member of IEEE Reliability Society AdCom (2013-2019), Re-elected for (2024-Present)
  4. Member, IEEE USA Artificial Intelligence Policy Committee, 2021 – present. 
  5. General Chair, ASME InterPACK 2024.