Recent Publications

JOURNAL PUBLICATIONS
  1. Critical Needs for Non-PFAS Semiconductor Packaging Materials, Lall. P., The BRIDGE Journal of the National Academies of Engineering, Vol. 54, No. 2, pp. 31-37, Summer 2024.
  2. Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor with Supercapacitive Material for Astronaut in Extreme Condition, Lall, P., Jang, H., and Hill, C., ASME. J. Electron. Packag., 146(4): 041114. https://doi.org/10.1115/1.4065940, December 2024.
  3. Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink, Lall, P., Bimali, S., and Miller, S., ASME. J. Electron. Packag. 146(4): 041116. https://doi.org/10.1115/1.4066041, December 2024. 
  4. Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging, Lall, P., Mehta, V., Suhling, J., and Blecker, K., ASME. J. Electron. Packag.; 146(3): 031006. https://doi.org/10.1115/1.4064521, September 2024.
  5. Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure, Lall, P., Pandurangan, A. R. R., and Blecker, K., ASME. J. Electron. Packag.; 146(3): 034502. https://doi.org/10.1115/1.4064604, September 2024.
  6. Leadfree SAC Solder Materials Characterization at High Strain Rates at Low Test Temperatures And Drop & Shock Simulation Using Input-G Method, Lall, P., Yadav, V., Suhling, J. C., and Locker, D., ASME. J. Electron. Packag. doi: https://doi.org/10.1115/1.4062868, June 29, 2023.
  7. Process Development for Printed Copper with Surface Mount Devices on Inkjet Metallization, Lall, P., Goyal, K., and Hill, C., ASME. J. Electron. Packag. 145(2): 021011. https://doi.org/10.1115/1.4055986, June 2023.
  8. Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging, Lall, P., and Jang, H., ASME. J. Electron. Packag. 145(1): 011108. https://doi.org/10.1115/1.4056412, March 2023. 
  9. Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications, Lall, P., Choudhury, P., and Miller, S., ASME. J. Electron. Packag. March 2023; 145(1): 011109. https://doi.org/10.1115/1.4056477, January 11, 2023. 
  10. Multilayer Conductive Metallization with Offset Vias Using Aerosol Jet Technology, Lall, P., Goyal, K., and Miller, S., ASME. J. Electron. Packag. ,144(2): 021119, June 2022.
RECENT CONFERENCE PUBLICATIONS
  1. Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects, Lall, P., Karakitie, D., Miller, S., Paper IPACK2024-141879, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-10, October 8-10, 2024.
  2. Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment, Lall, P., Kulkarni, S., Miller, S., Paper IPACK2024-141881, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-10, October 8-10, 2024.
  3. Evaluation of Printed Logic Circuits With Additively Packaged GaN Bare Die Devices at High Temperatures, Lall, P., Soni, V., Karakitie, D., Miller, S., Paper IPACK2024-142113, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-7, October 8-10, 2024.
  4. Evolution of Mechanical Properties and Microstructure of SAC305 Lead Free Solder Subjected to Mechanical Cycling and High Temperature Aging, Maruf, M.A., Mazumder, G.R., Chakraborty, S., Suhling, J., Lall, P., Paper IPACK2024-141347, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-9, October 8-10, 2024.
  5. Evolution of Non-PFAS Underfill Properties Under High-Temperature Storage and Hygrothermal Exposure, Lall, P., Kasturi, M., Janowsky, L., Davis, E., Paper IPACK2024-141852, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-8, October 8-10, 2024.
  6. Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces, Lall, P., Choudhury, P., Pandurangan, A., Kasturi, M., Paper IPACK2024-143308, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-9, October 8-10, 2024.
  7. Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure, Lall, P., Pandurangan, A., Choudhury, P., Paper IPACK2024-142109, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-8, October 8-10, 2024.
  8. Oscillator Performance on Thermoformed Additive In-Mold Electronics for Automotive Applications, Lall, P., Harsha, A., Kulkarni, S., Miller, S., Paper IPACK2024-141877, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-8, October 8-10, 2024.
  9. Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics, Lall, P., Kulkarni, S., Miller, S., Paper IPACK2024-141889, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-12, October 8-10, 2024.
  10. Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation, Lall, P., Sarwar, M.G., Miller, S., Paper IPACK2024-141863, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-9, October 8-10, 2024.
  11. Reliability of Direct Write Additively Printed Sustainable Flexible Circuitry With ECA Under Sustained High-Temperature Operation, Lall, P., Sarwar, M.G., Miller, S., Paper IPACK2024-142111, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-6, October 8-10, 2024.
  12. Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface, Lall, P., Choudhury, P., Pandurangan, A., Paper IPACK2024-143310, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-7, October 8-10, 2024.
  13. Sequential High Temperature and Hygrothermal Exposure on the Evolution of Interfacial Fracture Toughness of TIM-Copper and EMC Interfaces, Lall, P., Kasturi, M., Paper IPACK2024-141853, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-14, October 8-10, 2024.
  14. Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity, Lall, P., Pandurangan, A., Choudhury, P., Paper IPACK2024-142108, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-8, October 8-10, 2024.
  15. State of Health Estimation Model Development for Li-Ion Battery Lifetime Considering Calendar Aging and Post-Knee Degradation, Lall, P., Soni, V., Bimali, S., Paper IPACK2024-142117, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-10, October 8-10, 2024.
  16. Study on the Impact of Prolonged High-Temperature Exposure on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration, Lall, P., Mehta, V., Suhling, J., Blecker, K., Paper IPACK2024-141845, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-14, October 8-10, 2024.
  17. Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter, Lall, P., Musa, F., Miller, S., Paper IPACK2024-141874, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-11, October 8-10, 2024.
  18. Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive, Lall, P., Bimali, S., Miller, S., Paper IPACK2024-141858, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-10, October 8-10, 2024.
  19. Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling, Lall P., Musa, F., Miller, S., Paper IPACK2024-141871, Proceedings of the ASME InterPACK, San Jose, CA. pp. 1-7, October 8-10, 2024.
  20. Prediction of High Strain Rate Properties of Bi-Doped SnAgCu Solders after Sustained High-Temperature Operation, Lall, P., Mehta, V., and Saha M., Proceedings of 10th IEEE Electronics System-Integration Technology Conference, Berlin, Germany. pp. 1-10, September 11-13, 2024.
  21. Fatigue-Fracture Propensity Measurement and Competing Risk Model for FCBGA Interfaces under Sustained Humidity and Temperature Exposure, Lall, P., Pandurangan, A., Choudhury, P., Kasturi, M., and Suhling, J., In Proceedings of ECTC 2024 Conference. Denver, CO, USA, pp. 142-149, May 28-31, 2024.
  22. Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders Under Sustained High Temperature Operation, Lall, P., Mehta, V., Saha, M., Suhling, J., and Locker, D., In Proceedings of ECTC 2024 Conference. Denver, CO, USA, pp. 1530-1537, May 28-31, 2024.
  23. Interfacial Reliability and Predictive Models for Potted Board Assemblies in Inclined 25000 g Mechanical Shock, Lall, P., Pandurangan, A., Choudhury, P., Suhling, J., and Blecker, K., In Proceedings of ECTC 2024 Conference. Denver, CO, USA, pp. 221-228, May 28-31, 2024.
  24. A Data-Driven Machine Learning Model for the Stress-Strain Behavior of Single Grain SAC305 Solder Joints, Mondal, D., Suhling, J. C., Mirkoohi, E., and Lall, P., In Proceedings of ECTC 2024 Conference. Denver, CO, USA, pp. 670-677, May 28-31, 2024.
  25. Comparison of Sustainable and Non-Sustainable Ink Process-Performance Interactions for Additively Printed Circuits., Lall, P., Soni, V., Bimali, S., Karakitie, D., and Miller, S., In Proceedings of ECTC 2024 Conference. Denver, CO, USA, pp. 982-989, May 28-31, 2024.
  26. Additively Printed In-Mold Electronics Circuits and Sensors and Process-Performance Interactions for Automotive Applications, Lall, P., Soni, V., Jang, H., Musa, F., Sarwar, M. G., and Miller, S., In Proceedings of ECTC 2024 Conference. Denver, CO, USA, pp. 1198-1205, May 28-31, 2024.
  27. Reliability Assessment of Encapsulated Flexible Hybrid Electronic Assemblies Under Board-Level Drop Test, Lall, P., Karakitie, D., and Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1028-1034, May 28-31, 2024.
  28. Repairability Of Additively Printed Circuits using Sustainable Aqueous-Based Silver Nanoparticle Ink on Polymide Substrates, Lall, P., Karakitie, and Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp.1035-1043, May 28-31, 2024.
  29. Fabrication and Reliability Evaluation of Additively Printed Temperature and Humidity Sensor on Additively Manufactured ABS Substrate, Lall, P., Jang, H., and Hill, C., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1044-1050, May 28-31, 2024.
  30. Screen-Printed Thermoformed Circuits Performance and Reliability under Sustained High Temperatures for In-Mold Electronics., Lall, P., Kulkarni, S., and Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1051-1062, May 28-31, 2024.
  31. Reliability of Additively Printed In-Mold Electronics Using ECA in Sustained High-Temperature Operation, Lall, P., Sarwar, Md. G., and Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1063-1068 May 28-31, 2024.
  32. Performance Stability and Reliability of Gravure Offset Printed Thermoformed IME Circuits Subjected to Sustained High Temperature Storage, Lall, P., Soni, V., and Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1069-1078, May 28-31, 2024.
  33. Biodegradable Substrates for Sustainable Aerosol-Jet Additively Printed Electronics, Lall, P., Karakitie, D., Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1183-1192, May 28-31, 2024.
  34. Performance Analysis of Screen-Printed Functional Circuits on Biodegradable PET Substrates using Low-Temperature ECA for SMD Component Attachment, Lall, P., Kulkarni, S., Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1193-1202, May 28-31, 2024.
  35. Impact of Thermal Cycling on In-Mold Flexible Substrates Fabricated via Direct-Write Printing, Lall, P., Musa, F., Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1203-1210, May 28-31, 2024.
  36. Advancing Sustainability in Printed Electronics: Low-Temperature Interconnects and Water-Based Ink Performance, Lall, P., Bimali, S., Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1211-1220, May 28-31, 2024.
  37. Development of In-Mold Integration of EDA Sensors via Additive Printing, Lall, P., Jang, H., and Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA. May 28-31, 2024.
  38. Performance Comparison of Sustainable and Non-sustainable Silver Inks through a Printed Differentiator Circuit, Lall, P., Bimali, S., Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1221-1228, May 28-31, 2024.
  39. Sustainability and Life Cycling Investigation of Buck Charging Circuits Printed using Gravure Offset Printing, Lall, P., Soni, V., Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1229-1238, May 28-31, 2024.
  40. Development of In-Mold Integration of EDA Sensors via Additive Printing, Lall, P. Jang, H., Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1378-1386, May 28-31, 2024.
  41. Process-Performance Interaction of In-Mold Electronics for Signal Processing Applications, Lall, P., Musa, F., and Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1387-1396, May 28-31, 2024.
  42. Development and Performance Evaluation of Additively Printed In-Mold-Electronic Sensors, Lall, P., Soni, V., and Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1397-1404, May 28-31, 2024.
  43. Prediction of Failure at FCBGA Interfaces under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model, Lall, P., Pandurangan, A., Choudhury, P., and Kasturi, M., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1433-1445, May 28-31, 2024.
  44. Effect of Temperature and Humidity Conditioning on EMC-to-Substrate Interfacial Delamination Subjected to Monotonic and Fatigue Loading, Lall, P., Kasturi, M., Williamson, J., and Mathew, V., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1446-1456, May 28-31, 2024.
  45. Investigation of Fatigue Performance for Bulk Epoxy Molding Compound (EMC) in Sustained High-Temperature Environment up to 1 Year Aging, Lall, P., Zhang, Y., and Suhling, J., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1457-1464, May 28-31, 2024.
  46. Prediction of the Mechanical Responses of Single Grain Lead-Free Solder Joints using Machine Learning, Mondal, D., Suhling, J., Mirkoohi, E., and Lall, P., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1496-1503, May 28-31, 2024.
  47. Modeling of the Temperature Cycling Performance of BGA Packages with Hybrid SAC/LTS Joints and Various Bi Concentration Gradients, Chakraborty, S., Mondal, D., Suhling, J., and Lall, P., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1504-1513, May 28-31, 2024.
  48. Explicit FE Failure Prediction of Potted Assemblies under Inclined High-G Shock Loads, Lall, P., Pandurangan, A., and Blecker, K., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1536-1546, May 28-31, 2024.
  49. Reliability Performance Analysis of Magnetically Oriented ACA for Flexible and Stretchable Electronics, Lall, P., Zhang, Y., and Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1547-1554, May 28-31, 2024.
  50. Thermal Conductivity and Interface Strength Evolution of TIM-Copper with Temperature and Humidity Conditioning, Lall, P., Kasturi, M., Williamson, J., and Mathew, V., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1576-1589, May 28-31, 2024.
  51. Study of High-G Level Shock Damage-Accrual in Doped/Undoped SAC Solders during Prolonged Sustained Operation at 100°C, Lall, P., Mehta, V., Suhling, J., and Locker, D., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1618-1629, May 28-31, 2024.
  52. Investigation of the Effects of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies in Vibration, Lall, P., Mehta, V., Suhling, J., and Locker, D., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1630-1642, May 28-31, 2024.
  53. Effects of Combined Isothermal Aging and Mechanical Cycling Exposures on the Mechanical Behavior of Lead-Free Solder Alloys, Maruf, M. A., Mazumder, R. M., Chakraborty, S., Suhling, J., and Lall, P., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1664-1671, May 28-31, 2024.
  54. Characterization of the Mechanical Response and Microstructure of iSAC Lead-Free Solder, Mazumder, R. M., Maruf, M. A., Chakraborty, S., Suhling, J., and Lall, P., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1672-1678, May 28-31, 2024.
  55. Development and Performance Evolution of Thermoformed In-Mold Gravure Offset Band-Pass Filters due to Thermal Cycling, Lall, P., Choudhury, P., Soni, V., and Miller, S., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1706-1712, May 28-31, 2024.
  56. Assessment and Comparison of Interface Fracture Toughness in Potting/Substrate Material Systems using ENF and CNF Bi-material Specimen, Lall, P., Choudhury, P., Pandurangan, A, and Blecker, K., In Proceedings of the ITHERM Conference. Denver, CO, USA, pp. 1713-1719, May 28-31, 2024.
  57. Assessment of Competing Risk-of-Failure in FCBGA Interfaces Operating in Harsh Automotive Underhood Environments for Periods up to 1-Year, Lall, P., Pandurangan, A., Choudhury, P., and Kasturi, M., Proceedings of EUROSIME 2024.  Catania, Sicily, Italy, pp. 1-10, April 7-10, 2024.
  58. Artificial Intelligence-Based Methods for Assessment of Accrued Damage and Remaining Use-Life in Automotive Underhood Electronics, Lall, P., T. Thomas and V. Mehta, Pan Pacific Strategic Electronics Symposium (Pan Pacific), Kona, Big Island, HI, USA, pp. 1-12, Jan 29-Feb 1, 2024
  59. Realization of Sustainable Additively Printed Circuits using Aerosol-Jet Inkjet and Direct-Write Processes, Lall, P., V. Soni, J. Narangaparambil, S. Kulkarni and S. Miller, Pan Pacific Strategic Electronics Symposium (Pan Pacific), Kona, Big Island, HI, USA, pp. 1-9, Jan 29-Feb 1, 2024