Manufacturing – Additive Printed Electronics

Synopsis

The focus of the research effort is on understanding the underlying relationships in process parameters and product variation for subtractive, semi-additive, and additive manufacturing solutions.  Processes used in the manufacture of flexible hybrid electronics are being studied for wearable and harsh environment applications. Physics based relationships will be developed between reflow processes, assembly-warpage, resolution, thickness and sheet resistance, tolerance, print consistency – line edge roughness, loss or gain in dimension, uniformity in thickness, layer roughness, and yield.

Representative Publications

1. Lall, P., Goyal, K., and Miller, S., “Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology.” ASME. J. Electron. Packag. ,144(2): 021119, June 2022.
2. Lall, P., Narangaparambil, J., Soni, V., and Miller, S., “Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias.” ASME. J. Electron. Packag. 144(2): 021117, June 2022
3. Lall, P., J. Narangaparambil, and S. Miller, Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications, in Proceedings of the IEEE Electronic Components and Technology Conference, pp. 1172-1183, May 31-June 3, 2022.
4. Lall, P., K. Goyal, J. Narangaparambil, and S. Miller, Reliability of Component Attachment using ECA and LTS on Flexible Additively Printed Ink-Jet Circuits for Signal-Filtering in Wearable Applications, in Proceedings of the IEEE Electronic Components and Technology Conference, pp. 2033-2044, May 31-June 3, 2022.
5. Lall, P., Jang, H., Narangaparambil, J., Goyal, K., & Hill, C., Additively Printed Flexible Temperature Sensor for Wearable Applications. Proceedings of ASME InterPACK, Vol. 85505, p. V001T03A005, 8-pages, IPACK2021-74071, October 26-28, 2021.
6. Lall, P., Narangaparambil, J., Schulze, K., & Miller, S., Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment. Proceedings of ASME InterPACK, Vol. 85505, p. V001T03A006, 11-pages, IPACK2021-74073, October 26-28, 2021.
7. Lall, P., A. Abrol, N. Kothari, B. Leever, and S. Miller, Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours, in Proceedings of the ASME Journal of Electronic Packaging, Vol. 142, No.4, 041003-1 – 041003-12, December 2020.
8. Lall, P., K. Goyal, N. Kothari, B. Leever, and S. Miller, Additively Printed Multilayer Substrate Using Aerosol-Jet Technique, in Proceedings of the ASME Journal of Electronic Packaging, Vol. 142, No. 4, 041110-1 – 041110-11, December 2020.
9. Lall, P., T. Thomas, V. Yadav, J. Narangaparambil, W. Liu, Acceleration Factor Modeling of Flexible Substrates from Actual Human Body Measurements, in Proceedings of the ASME Journal of Electronic Packaging, Vol. 142, No. 4, 041113-1 – 041113-11, December 2020.
10. Lall, P., J. Narangaparambil, B. Leever, and S. Miller, Flexure and Twist Test Reliability Assurance of Flexible Electronics, in Proceedings of the ASME Journal of Electronic Packaging, Vol. 142, No.3, 031121-1 – 031121-12, September 2020.