Influence of Temperature on Microelectronic and System Reliability, by P. Lall, Pecht, M., Hakim, E., CRC Press, Inc., Boca Raton, Florida, 1997; eBook 2020.

Mechanical Design of Electronic Systems, J. Dally, P. Lall, J. Suhling, 664 Pages, College House Enterprises, 2008.

Testing and Reliability Characterization Methods for Flexible Hybrid Electronics, Lall, P., Narangaparambil, J., Goyal, K., in book titled, Flexible, Wearable and Stretchable Electronics, edited by Sakuma, K., pp. 303-335, CRC Press, Boca Raton, FL, 2021.

Nano-underfills and Potting Compounds for Fine-Pitch Electronics, Lall, P., Islam, S., Dornala, K., Suhling, J., Shinde, D., in Nano-Packaging: Nanotechnologies in Electronics Packaging, edited by James Morris, pp. 513-574, Second Edition, Springer, 2018. 

Cooling in Electronic Applications, P. Lall in – Handbook of Thermal Engineering edited by Raj P. Chhabra, CRC Press, Boca Raton, Florida, Chapter 4.22, pp. 1078-1130, 2nd Edition, 2017.

Damage Pre-Cursors Based Assessment of Accrued Thermomechanical Damage and Remaining Useful Life in Field Deployed Electronics, P. Lall, M. Harsha, K. Goebel and J. Jones, in Book Titled – Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research edited by Madhusudan Iyengar, Karl J. L. Geisler and Bahgat Sammakia, 2014. 

Electronic Packaging Applications, Suhling, J., Lall, P., in Handbook of Experimental Solid Mechanics, edited by William Sharpe, pp. 1015-1044, Springer, 2008

Semiconductor Devices: Chip-Scale Packaging, P. Lall, in – Encyclopedia of Electrical and Electronics Engineering, edited by J. Webster, John Wiley & Sons, New York, NY, 1999.