The following CAVE3 paper won the Best-Poster Paper Award at the ASME InterPACK and ICNMM 2015 Conference held in San Francisco, CA on July 6-9, 2015.

Lall, P., Deshpande, S., Nguyen, L., Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015

Pictured from Left-to-Right: Pradeep Lall (AU) and Shantanu Deshpande (AU)