The following CAVE3 papers will be presented at the ASME InterPACK 2015 in San Francisco, California.  Several students are travelling to the conference to present the papers along with Professor Lall.

1. Lall, P., Deshpande, S., Nguyen, L., Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
2. Lall, P., Sakalaukus, P., Davis, L., An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions, Paper IPACKICNMM2015-48257; Session 1-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
3. Lall, P., Luo, Y., Nguyen, L., Chlorine Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages, Paper IPACKICNMM2015-48639; Session 1-3-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
4. Lall, P., Zhang, H., Davis, L., Discoloration and Failure Mechanism Analysis of High Power pc-LED Under Harsh Environment in Presence of Contamination, Paper IPACKICNMM2015-48724; Session 1-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
5. Lall, P., Wei, J., LED Chip Deformation Measurement During the Operation Using the X-ray CT Digital Volume Correlation, Paper IPACKICNMM2015-48785; Session 14-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
6. Lall, P., Abrol, A., Simpson, L., Glover, J., Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Shock Environments, Paper IPACKICNMM2015-48790; Session 3-1-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
7. Lall, P., Yadav, V., Suhling, J., A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures, Paper IPACKICNMM2015-48389; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
8. Lall, P., Kothari, N., Glover, J., Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments, Paper IPACKICNMM2015-48457; Session 3-3-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
9. Lall, P., Mirza, K., Suhling, J., DIC Based Investigation into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint, Paper IPACKICNMM2015-48727, Session 14-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015