Date: September 23, 2014
Contact: Morgan Stashick, stashml@auburn.edu
Pradeep Lall, Thomas Walter professor in Auburn University’s Department of Mechanical Engineering, was honored with the Exceptional Technical Achievement Award by the Institute of Electrical and Electronics Engineers’ (IEEE) Components, Packaging and Manufacturing Society. The award was presented to Lall, who is also director of Auburn’s National Science Foundation Center for Advanced Vehicle and Extreme Environment Electronics, at the 64th IEEE Electronics Components and Technology Conference (ECTC) held in Orlando, Fla.
Lall received the award for his exceptional contributions to the field of electronics reliability and manufacturing. His seminal work in the use of high speed imaging for measurement of interconnect and board assembly strains under shock and vibration has enabled the development of solutions for electronics survivability in high-g environments.
“High-g survivability is of great relevance for aerospace, defense, automotive and communication product companies,” said Lall. “I have always wanted to work on tough problems, and it is fulfilling to see that our research has yielded advancements that have made a difference.”
Lall has served as a member of the Auburn faculty since 2002. A well-recognized researcher in the field of electronics reliability and prognostics, Lall is the recipient of the Surface Mount Technology Association’s Member of Technical Distinction Award, as well as the SEC’s Auburn University Faculty Achievement Award and the College of Engineering’s Senior Faculty Research Award. He has received three Motorola Outstanding Innovation Awards, five Motorola Engineering Awards and 23 best paper awards at national and international conferences.
ECTC is the premier international conference in packaging, components and microelectronic systems science, and technology and was attended by more than 1,200 representatives from some 25 countries. The IEEE Components, Packaging and Manufacturing Technology Society is a leading international forum for scientists and engineers engaged in the research, design and development of advances in microsystems packaging and manufacturing.