Month: July 2015
-
CAVE3 Team attends ASME InterPACK and ICNMM 2015 Conference to Present Research Papers
The following students from Professor Lall’s research team visited the ASME InterPACK and ICNMM 2015 Conference in San Franscisco from July 6-9, 2015 to present their research papers: Hao Zhang Yihua Luo Nakul Kothari Vikas Yadav Shantanu Deshpande Junchao Wei Amrit Abrol Peter Sakalaukus. Pictured from Left-to-Right: Hao Zhang, Yihua Luo, Nakul Kothari, Vikas Yadav,…
-
CAVE3 Paper wins the Best-Poster Paper Award at the ASME InterPACK and ICNMM 2015
The following CAVE3 paper won the Best-Poster Paper Award at the ASME InterPACK and ICNMM 2015 Conference held in San Francisco, CA on July 6-9, 2015. Lall, P., Deshpande, S., Nguyen, L., Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME International Technical Conference and Exhibition…
-
CAVE3 Papers to be Presented at the ASME InterPACK 2015, San Francisco, California, July 6-9, 2015
The following CAVE3 papers will be presented at the ASME InterPACK 2015 in San Francisco, California. Several students are travelling to the conference to present the papers along with Professor Lall. Lall, P., Deshpande, S., Nguyen, L., Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME…